Stress-Strain Microprobe®
SSM-B4000TM System
US Patent 4,852,397
The SSM system, using the Automated Ball IndentationTM (ABI) test technique, is the only system that performs localized and and nondestructive tests to measure actual key mechanical properties of metallic structures or very small samples. The SSM system with its ABI test replaces conventional universal testing machines for tension and fracture toughness testing and eliminates the need to cut components and specimens.
Benchtop System:
SSM-B4000 - 17.80 KN / 4000 lb
SSM-SuiteTM software included with each turnkey system includes ABI and Tensile Test modules. The benchtop system also operates as computer-controlled universal test machine for conventional destructive testing if desired.
The SSM system is a complete mechanical testing lab in one machine.
Accessories:
SSM-SuiteTM Modules (not included with turnkey system)
- Destructive Fracture Toughness (E813, E1737, E1820)
- Indentation-CreepTM
- Indentation-Stress-RelaxationTM
- Fiber Push-out
Indenters:
Materials available:
- Tungsten Carbide
- Silicon Nitride
Sizes available:
- 0.25 mm /0.010 in
- 0.051 mm/0.020 in
- 0.76 mm/0.030 in
- 1.57 mm/0.062 in
Load cell and conditioner:
Sizes available:
- 22.7 kg/50 lb
- 45.4 kg/100 lb
- 113.4 kg/250 lb
- 226.8kg/500 lb
- 454.0kg/1000 lb
- 2270kg/5000 lb
X-Y Positioning Table, video camera, camera support
Video capture card and integrated software
Fiber optic illumination kit
Cool/Heat chamber and controller - model ENV800
temperature range: -157oC/250oF to 800oC/1472oF
Swivel Mount for specimen leveling
LVDT and signal conditioner (spare or replacement)
LVDT calibration instrument
Fracture toughness grips:
for specimen thickness 4.57mm/ 0.18in & 12.70mm/0.50 in
Clip gage and signal conditioner for fracture toughness
Clip gage calibration instrument
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